Matrix is a Registered Trademark of Matrix Integrated Systems, Inc.Matrix 105 provides high throughput in a single wafer system capable of handling wide variety of substrates, including round, square and ranging from 3” up to 6”. By maintaining independent closed-loop system controls, the system optimizes vital device parameters.
Single Wafer, Multi-Step Processing
Closed-Loop Temperature Control
Pressure Control
Accurate, closed-loop pressure control with “butterfly-style” throttle valve and capacitance manometer
RF power: 100 to 500 watts
Timed cycles up to 4 hour each
Matrix105 Applications
Photoresist Stripping
High dose implant (As+, B+, P+)
Post-polysilicon etch
Post-metal etch
Post-oxide etch
Rework
Controlled Resist Removal
Post-develop descum (pre-etch)
Dry/wet process capability
Resist planarization
Uniformity capability (5% 1s)
GaAs wafer Stripping and Descum
Thin Film Head Resist Cleaning and Surface Treatment
MEMS (Micro Electro- Mechanical Systems) Up to 4 hour processes
Matrix 105 consists of the following major assemblies:
Main Console:
Process Model,
Operator interface Model,
Wafer Transport Module,
Elevator Module,
PC Control Module.
Power Supply Console:
RF Generator,
DC Supply,
AC Distribution,
Gas Distribution panel,
Temperature/Pressure Control Module.
Vacuum Pump (optional):